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當前所在位置:首頁 >產品中心>激光切割機

激光精密陶瓷打孔切割設備——Laser Precision Ceramic Drilling

產品特點:

設備介紹 PRODUCT DESCRIPTION

目前陶瓷基板的高散熱性能及穩定性越來越受到大功率器件的青睞, 為了滿足陶瓷基板的高速打孔及劃線\切割需求, 我們特推出了雙工位激光精密陶瓷打孔切割專用機M3。

該設備使用高功率、長壽命的光纖激光器為光源,可以輕松實現 打孔、劃線及切割的需求。 為了進一步提高設備的使用效率,特配置了雙工位工作臺,最大限度的提高操作效率。

At present, the high heat dissipation performance and stability of ceramic substrate are more and more favored by high-power devices. In order to meet the needs of high-speed drilling and marking of ceramic substrate, we have introduced a special machine for dual-station laser precision ceramic drilling and cutting.

The device uses a high-power and long-life optical fiber laser as a source, so that the requirements of drilling, marking and cutting can be easily realized. In order to further improve the use efficiency of the equipment, the double-station working table is specially configured, and the operation efficiency is improved to the maximum extent.



詳細介紹
視頻展示

技術參數

項目

參數

型號 Model

M3

激光波長 Wavelength

~1070nm

峰值功率 Peak Power

1500W

平均功率 Average Power

200W

切割方式 Cutting Method

切割頭 Cutting Head

工作行程 Working Area

400X400mm

工位 Station

2(滿足 5 寸)

設備尺

Machine Dimension

1400X1250X1650mm

工作電壓/功率 Voltage/Power

380VAC /~3KW

重量 Weight

1200kg

加工效果



技術特征 


高功率長壽命工業光纖激光器

激光器性能穩定,光斑質量好,可滿足板陶瓷應用的絕大多數切割應用

龍門雙驅平臺,結構緊湊、工作效率高

友好的設備操作軟件

基于 Windows 的操作界面,操作簡單、友好

自動匹配靶標,多數靶標不需要設置;一次加工接受不同直徑靶標

自動漲縮補償

適合皮秒等超短脈沖激光高頻的脈沖控制、深度控制功能

加工過程焦點自動補償功能

加工過程,散熱控制功能

全幅面精度補償

用戶分級管理

加工參數分級管理

功率補償功能

配合自動化

專業軟件優化/生成切割路徑

可解析多種常用文件格式,同時具備圖形優化及特殊功能的路徑生成功能。

圖形靶標自動識別

雙工位工作臺

PRODUCTFEATURES

High power and long life industrial fiber laser

The laser has stable performance and good spot quality, which can meet the needs of most cutting applications of plate ceramics.

The gantry double-drive platform has the advantages of compact structure and high working efficiency.

The operation interface based on Windows is simple and friendly.

Automatic matching target, most targets do not need to be set; accept different diameter targets in one processing.

Automatic compensation for fluctuation and contraction.

Suitable for picosecond and other ultra-short pulse laser high frequency pulse control and depth control function.

Automatic compensation function during processing.

Heat dissipation control function during processing.

Full-breadth precision compensation.

User hierarchical management.

Hierarchical management of processing parameters.

Power compensation function. 

Professional software optimization/ generation of cutting path

Can resolve a variety of common file formats, and have the path generation capability of drawing optimization and special functions.

Image target automatic identification.

Double station worktable.



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